Interlink Electronics Announces Key Leadership Appointments to Drive the Next Phase of Business Grow

Business Wirevia The Motley Fool
Updated

Interlink Electronics Announces Key Leadership Appointments to Drive the Next Phase of Business Growth Initiatives

CAMARILLO, Calif.--(BUSINESS WIRE)-- Interlink Electronics, Inc. (OTC: LINK) announced today leadership appointments on the executive team that will drive the next phase of business growth initiatives. Under this plan, Declan Flannery will assume the role of Managing Director of the Force-Sensing Resistor (FSR®) Business Unit and Howard Goldberg, Ph.D. will assume the role of Chief Operating Officer (COO). The changes are effective immediately.

As reported in prior press releases, Q1 of 2013 represented the completion of the transition of Interlink Electronics from a business restructuring phase into a growth phase as demonstrated by 2012 being the first profitable year since 2000. These executive appointments are being implemented to enable Interlink Electronics to focus on and drive its strategic business growth initiatives for 2013 and beyond. The key aspects of these strategic business growth initiatives are focused around the following key areas:

  • Expansion and enhancement of the core FSR® product portfolio.

  • Further increase the performance envelope of the core FSR® printed electronics technology.

  • Achieve ISO/TS 16949 certification to support the growing automotive business.

  • Improve profitability through further optimization of the internal business processes and metrics.

  • Establish a scalable infrastructure to support future growth through the implementation of a Shared SG&A and Manufacturing Services model.

  • Continue to identify potential acquisitions and business partnership opportunities.


"The foundation of our growth strategy is to establish the core FSR® product portfolio as a separate business unit and to have it supported by a global infrastructure that drives profitability and scales with future growth. Declan Flannery, with his years of demonstrated expertise in growing our FSR® business coupled with his in-depth knowledge of the printed-electronics industry, was the perfect fit to become the Managing Director of the FSR® business unit. Howard Goldberg, with his proven track record of managing $30MM+ high-tech P&L's with multiple global sites will bring this experience to his new role as COO as he assumes responsibility for overseeing our global business enterprise," stated Steven N. Bronson, the Chairman and CEO of Interlink Electronics. Mr. Bronson continued, "These executive appointments will allow us to become more strategically focused in order to drive both organic and inorganic growth opportunities. This is part of our overall philosophy to continuously increase the value we bring to our customers, shareholders, and employees."

About Interlink Electronics, Inc.

Interlink Electronics, Inc. (OTC: LINK) is a world leader in the design of patented Force-Sensing Resistor (FSR®) technology. For over 28 years, Interlink Electronics' solutions have focused on handheld user input, menu navigation, cursor control, & other intuitive interface technologies for the world's top electronics manufacturers. Interlink Electronics has a 16-year track record of supplying human machine interface ("HMI") solutions for mission-critical and rugged applications. Interlink Electronics serves a world-class customer-base from its corporate headquarters in Camarillo, California, and offices in Japan, Hong Kong and China. For more information, see http://www.interlinkelectronics.com.

This release contains forward-looking statements that involve a number of risks and uncertainties. The following are among the factors that could cause actual results to differ materially from the forward-looking statements: historical losses and negative cash flow, the success of business divestitures and acquisitions, the ownership of the majority of our stock by a small group of investors, our success in predicting new markets and the acceptance of our new products, efficient management of our infrastructure, the pace of technological developments and industry standards evolution and their effect on our target product and market choices, the effect of outsourcing technology development, changes in the ordering patterns of our customers, a decrease in the quality and/or reliability of our products, protection of our proprietary intellectual property, competition by alternative sophisticated as well as generic products, pending litigation against Interlink, historical weaknesses in internal controls over financial accounting, the continued availability at competitive prices of raw materials for our products, disruptions in our manufacturing facilities, risks of international sales and operations including fluctuations in exchange rates, compliance with regulatory requirements applicable to our manufacturing operations, and customer concentrations. The forward-looking statements contained in this release should be considered in light of these risk factors.



Interlink Electronics
For Investor Relations:
Steven N. Bronson, +1 805-484-8855 ext. 112
CEO
sbronson@interlinkelectronics.com
or
For information on Interlink Electronics' products & solutions:
Paul Kelley, +1 805-436-0271
Global Sales Manager
pkelley@interlinkelectronics.com

KEYWORDS: United States North America California

INDUSTRY KEYWORDS:

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